Heat Sink Design Investigation via CFD Thermal Analysis and Additive Manufacturing Rapid Prototyping

Abstract

This study investigates the thermal performance of pin-fin heat sink designs by integrating Computational Fluid Dynamics (CFD) simulation with high-precision Additive Manufacturing (AM) rapid prototyping. Various pin-fin geometries—including circular, rectangular, and triangular—were modeled in CFD to evaluate their thermal behavior under different operating conditions. The simulations utilized the standard k-ε turbulence model, which demonstrated the best agreement with experimental data obtained through wind tunnel testing. Results indicate that the triangular pin-fin geometry offers superior thermal performance compared to both circular and rectangular configurations. This is evidenced by lower average surface temperatures and higher Nusselt numbers, indicating enhanced heat transfer and dissipation efficiency. The triangular design also promotes more effective airflow, increasing fluid mixing and prolonging the interaction between cooling air and heat sink surfaces. These effects are especially significant at higher heat input levels and Reynolds numbers, highlighting the design’s effectiveness under demanding thermal loads. The study further explored the influence of hollow core designs on thermal performance. While hollow spherical fins improved convection due to their streamlined shapes and smoother airflow, hollow triangular and rectangular fins introduced sharp edges that disrupted flow, reducing thermal efficiency. These findings emphasize that the thermal benefits of hollow geometries depend strongly on maintaining uninterrupted airflow pathways. Finally, prototypes manufactured via Laser Powder Bed Fusion (LPBF) closely matched the simulation outcomes, validating the proposed integrated approach. The results demonstrate the effectiveness of combining CFD and AM for practical, high-performance heat sink design. This research provides valuable insights for developing advanced thermal management solutions in high-density electronic applications.